An entire info to 3D MEMS packaging methods and choices
Written by specialists inside the topic, Advanced MEMS Packaging serves as a invaluable reference for these confronted with the challenges created by the ever-rising curiosity in MEMS devices and packaging. This authoritative info presents chopping-edge MEMS (microelectromechanical strategies) packaging strategies, resembling low-temperature C2W and W2W bonding and 3D packaging.
This definitive helpful useful resource helps you select reliable, inventive, high-effectivity, robust, and worth-environment friendly packaging strategies for MEMS devices. The book might even help in stimulating further evaluation and enchancment in electrical, optical, mechanical, and thermal designs along with provides, processes, manufacturing, testing, and reliability. Among the many many topics explored: Advanced IC and MEMS packaging developments MEMS devices, business functions, and markets Larger than 360 MEMS packaging patents and 10 3D MEMS packaging designs TSV for 3D MEMS packaging MEMS wafer thinning, dicing, and coping with Low-temperature C2C, C2W, and W2W bonding Reliability of RoHS-compliant MEMS packaging Micromachining and water bonding strategies Actuation mechanisms and constructed-in micromachining Bubble change, optical change, and VOA MEMS packaging Bolometer and accelerameter MEMS packaging Bio-MEMS and biosensor MEMS packaging RF MEMS switches, tunable circuits, and packaging